Multilayer PCB

Multilayer PCB

Multilayer PCBs are regular electronic manufacturing boards with two or more interior layers that have a compact design, a number of uses, a light production process, and durability. Additionally, flexibility for a variety of industries, such as consumer electronics, telecommunications, defense, and the military, is important. PCB.

Multilayer PCB made

In order to create a multi-layer PCB, prepreg, an epoxy-infused fiberglass sheet, and conductive composite materials are alternately bonded together using a hydraulic press at a high temperature and pressure. The prepreg melts under pressure and heat, connecting the layers together.

The PCB Lamination Process

Lamination occurs after the inner layer has been applied to the PCB during the circuit board fabrication. All circuit boards, which are made up of a substrate, laminate, solder mask, and silkscreen, have a similar lamination. Steps in PCB Lamination Process

  1. Fingerprints, dry film stripping, anti-foam residues, corrosion, and dry film are all removed from panels through washing.
  2. Utilizing a standardized brown or black oxides treatment, micro-etching is used to minimize copper thickness. This oxide process is utilized to improve the adherence of the epoxy resin while preventing issues like metal fatigue.
  3. On the gluing machine, the prepreg and inner layers are piled before being joined by glue.
  4. After the boards have been attached, registration is finished and the PCBs are strengthened by joining the innermost surface to the adhesive using rivets along the useless board edge. By strengthening the stack-up, this makes it more likely that it won’t shift throughout the PCB lamination procedure. The stack-up is finished by sandwiching the copper foil between two pieces of prepreg made of stainless steel.
  5. The stack-up is then exposed to extremely high temperatures; the temperature is determined by the data sheets for the materials utilized. 
  6. Layers are transferred onto a cold press, un-molded, and prepped with registration pores using an X-ray equipment after exposed to high temperatures and pressures.
  7. Panels are then remove contaminants before having their corners rounded.


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